SP-API Statement
SP-API Compliance & Data Security Statement
Effective Date: August 1, 2026
This Statement is established to comply with the Amazon Developer Services Agreement, the Amazon Data Protection Policy (DPP) (Revised November 2025), the Amazon Acceptable Use Policy (AUP), and all applicable data protection laws and regulations (including but not limited to GDPR, CCPA, etc.).
I. Entity Information
II. Compliance Commitment
We hereby declare that we have read, understood, and committed to strictly complying with all provisions of the following agreements and policies:
III. Data Collection & Use
This application integrates with the Amazon Selling Partner API (SP-API) to collect the following categories of personal data (PII), solely for the purposes of order processing, customer service, and legitimate business operations:
| Data Type | Purpose of Collection | User Authorization Method |
|---|---|---|
| Buyer name, shipping address, phone number | Order fulfillment and logistics tracking | Explicitly agreed upon by the user when placing an order on the Amazon platform |
| Order item details, transaction amount | Order synchronization and financial reconciliation | Same as above |
| Seller identifier (Seller ID), authorization token | API authentication and access control | Explicitly agreed by the seller during the authorization flow |
IV. Data Sharing & Third-Party Disclosure
V. Data Security Controls (Key Review Area for SP-API)
We have deployed and continuously maintain the following technical and administrative measures to ensure the security of PII:
| Control Area | Specific Requirement | Our Implementation Status |
|---|---|---|
| Transmission Encryption | TLS 1.2 or higher | ✓ TLS 1.3 Enabled |
| Encryption at Rest | PII storage encrypted with AES-256 or RSA 2048-bit or higher | ✓ AES-256 Enabled |
| Access Control | Account locked after 10 failed login attempts; password history retains the last 10 passwords; API keys rotated every 90 days | ✓ Configured |
| Incident Management | Designate a dedicated Incident Management Point of Contact (IMPOC) | ✓ IMPOC: Kenny; Email: impoc@melokea.com |
| Vulnerability Management | Critical vulnerabilities remediated within 7 days; high-risk vulnerabilities within 30 days | ✓ SLA Established |
| Log Retention | Security logs retained for at least 12 months | ✓ Configured |
| Data Retention | Non-PII data retained no longer than 18 months; PII deleted within 30 days after order delivery | ✓ Automated Cleanup Policy Set |
| Data Deletion | Upon receiving Amazon’s written deletion notice, secure deletion completed within 30 days; all online instances and backups purged within 90 days | ✓ Emergency Procedure Established |
VI. Permission Usage Statement
This application requests only the minimum permissions necessary for its intended functionality. In runtime environments of Android N / Fire OS 6 and above, permissions are requested dynamically in context (“while-in-use”), and we never pre-authorize or abuse permissions to collect irrelevant data.
VII. User Rights & Remedies
End users have the right to exercise the following rights with respect to their personal data: access, rectification, deletion, restriction of processing, data portability, and withdrawal of consent. Users may contact us through the following channels to exercise these rights:
VIII. Contact Information & Signatures
The following table sets forth the designated personnel responsible for data protection, privacy compliance, and security incident response:
| Role | Name | Phone | |
|---|---|---|---|
| Primary Contact (Legal Representative) | LINGLING SHANG | admin@melokea.com | +86 17055060013 |
| SP-API Integration Contact | LINGLING SHANG | admin@melokea.com | +86 17055060013 |
| IMPOC | Kenny | impoc@melokea.com | |
| Privacy Officer | Lisa | privacy@melokea.com | |
| Data Protection Officer (DPO) | Lisa | privacy@melokea.com |
Declaration
We hereby declare that all information provided above is true, accurate, and complete. We further commit to promptly updating this Statement and notifying Amazon of any material changes to the information set forth herein.
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